Category
WEICON 10051209 C Aluminium-filled Epoxy Resin 0.2Kg

WEICON C is a temperature-resistant and flowable epoxy resin system especially for industrial use. The adhesive is non-corrosive, anti-magnetic and cures practically without shrinkage. WEICON C is particularly suitable as an adhesive for large-scale applications, for pouring out moulds and for the production of fixing devices and tools (e.g. injection moulds). It can be used in the tool and mould making sector as well as in many other industrial areas subjected to high thermal stress.

Specification
Name
WEICON 10051209 C Aluminium-filled Epoxy Resin 0.2Kg
SKU
10051209
Brand
Condition
New
Curing
Pot life at 20 Degree C, 500 g batch 60 min
Additional layer after (35% strength) 4 h
Working strength after (80% strength) 6 h
Final strength (100% strength) 12 h
Shrinkage 0.07 %
Mechanical Properties after Curing
Tensile strength (DIN EN ISO 527-2) 50 MPa
Elongation at break (DIN EN ISO 527-2) 0.9 %
E-modulus (tensile) (DIN EN ISO 527-2) 6400–7500 MPa
Compressive strength (DIN EN ISO 604) 174 MPa
E-modulus (pressure) (DIN EN ISO 604) 6200–6700 MPa
Bending strength (DIN EN ISO 178) 83 MPa
Hardness (Shore D) (DIN ISO 7619) 89 ± 3
Taber Test (DIN ISO 9352, H18, 1 kg, 1000 rotations) 1.3 g / 0.8 cm³
Lap Shear Strength (DIN EN 1465, 1.5 mm thick)
Steel 1.0338 (sandblasted) 15 MPa
Stainless steel V2A (sandblasted) 16 MPa
Aluminium (sandblasted) 8 MPa
Galvanized steel 6 MPa
Thermal Parameters
Temperature resistance -80 to +220 Degree C
Tg after room temp. cure (DSC) ~ +58 Degree C
Tg after tempering at 120 °C (DSC) +120 Degree C
Heat deflection resistance (DIN EN ISO 75-2) +60 / +108 Degree C
Thermal expansion coefficient (ISO 11359) 40·10-6 K-1
Thermal conductivity (DIN EN ISO 22007-4) 0.65 W/m·K
Heat capacity (DIN EN ISO 22007-4) 0.96 J/(g·K)
Electrical Parameters
Volume resistance (DIN EN 62631-3-1) 2.11·1014 m
Magnetic No